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No, it's definitely MPF553 on the package and the die. I think the only differences between the 1400 and 1670 are the voltages (which don't matter to MESS) and more outputs. The 1670 die looks identical to the 1400.

I'll look at the 1990 die and figure out the pins. Almost always they are in order, numbered counter-clockwise. So if you can find power and ground, you can usually get the rest pretty easily. I posted a cleaned up die shot for Little Professor 1978, and I took pics of the TI-1000 die.

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TMS1400 pinout is from here: http://marc.info/?l=classiccmp&m=104965276917315&w=2

TMS16xx has 16 R outputs, that's trivial to emulate. And it also has a "K/L" select pin, L1,L2,L4,L8 input pins, and a Mode pin.

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Oh, yeah- I forgot about that email; I was looking for a datasheet. I can probably figure out some of the other pins from the 1670 die shot, but it would be nice to find a full data sheet on those newer chips.

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Originally Posted By hap
Quick question: on TMS1990, do you know which pad(as visible on die edge) goes to which pin?

I'm pretty sure that the top left pad in my pics is pin 24, with numbering going CCW. So the top of the die has all the O outputs. The first pad down the right side (partially under the plastic blob) is VSS (positive power), with VDD below it.
Notice that there are 29 pads! It looks like the one that's fourth down on the right side is also connected to VSS. I guess it was connected to the paddle?

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Here are the Plus One and Funtronics Jacks die shots:
www.seanriddle.com/plusonemetal.jpg
www.seanriddle.com/plusoneacid.jpg
www.seanriddle.com/jacks.jpg

The Plus One die stuck to the plastic, but it looks like there was also a black overlay of some sort. I've seen something similar with a few 3851 and 3870 dies.

It looks like Jacks has all the signals bonded out that are needed to dump the ROM. Pin one is the octagonal pad at center bottom, and all pins but 17 are bonded. I'm a little confused since that's G0 and it seems like if they used the other G outputs that they'd use G0 first.

Under higher magnification, I can see the ROM bits! So I'll dump Jacks electronically and transcribe the bits visually and figure out the physical to logical bit ordering. Then I'll see if I can clean up the Plus One die enough to read all the bits visually.

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Originally Posted By Olivier Galibert
Originally Posted By seanriddle
I've decapped the Sharp SM-510 from the Top Gun handheld LCD game and the Sharp SM-511 from the TMNT LCD game


Do you have the pictures? I'd like to compare with the game&watch, which is somewhere between the sm3903 and the sm510.

OG.
I posted a 55M pixel die shot of the SM510 from Top Gun with the top metal layer removed:
www.seanriddle.com/topgunacid.xcf

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Originally Posted By seanriddle
I posted a 55M pixel die shot of the SM510 from Top Gun with the top metal layer removed:
www.seanriddle.com/topgunacid.xcf


Very nice, it looks identical (except for the rom contents of course), so now we have a high res of metal and active.

Do you agree with having your die shots posted on siliconpr0n.org btw?

OG.

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Oh yeah, that's fine. John previously posted some of my Williams Special Chips shots there. I added a Creative Commons license logo to my decap page to be more clear.

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I uploaded the TI-1000 info: www.seanriddle.com/tms1990.html
Edit: there was a bit under the spot of dirt in the lower left, so I updated the dump.

Last edited by seanriddle; 03/30/15 11:44 PM.
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I posted the top metal die shot of the TMS1670 in Entex Jackpot Gin Rummy Black Jack: www.seanriddle.com/entexjackpotmetal.jpg

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